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The term low profile underfloor heating refers to extremely flat underfloor heating systems that do not require a heating screed and can therefore be realised with installation heights of 20 mm or less. There are specific advantages and disadvantages associated with thin-layer systems which determine the areas in which they can be used.
Benefits
- Due to the low installation height, thin-layer systems can be retrofitted on the existing floor surface. The installation height is below the height of door thresholds in old buildings, for example. Thermal insulation is only required for floors that do not have minimum thermal insulation. The design considerably reduces the work involved in retrofitting underfloor heating.
- The position of the heating pipes directly under the floor surface enables particularly rapid heating behaviour with even heat distribution.
- The low flow temperatures ensure noticeable savings in heating costs.
- The absence of an additional heating screed and the low weight of the thin underfloor heating reduces the load on the ceiling below.
Disadvantages
- The low height is achieved by using thin heating pipes, which have a comparatively high flow resistance. This limits the length of the heating circuits, which means that in larger rooms, several circuits must be installed that do not differ significantly in length.
- Floor slabs above basements or the ground, which have a high thermal resistance, must also be insulated. This cancels out the advantage of low installation height. Without thermal insulation, the heat output of a low profile underfloor heating system in energy-saving mode may not be sufficient to dissipate enough heat into the room in the case of external floor slabs.
- The levelling compound must not be applied too thickly so that the heat output can be provided close to the surface.
If the ceiling height is not sufficient for a standard installation of the wall heating, the drywall panels included in each kit can be installed horizontally.
In principle, installations that deviate from the standard drywall kits are possible, e.g. if there is not enough space for the standard number of drywall panels and the next smaller heating kit is too small. In such cases, it is advisable to ask our technical support team for an assessment of the planned project. We will check the feasibility of the project and put together a customised quotation.
In our experience, the 12.5 mm plasterboard is also strong enough for use in pitched roof applications. Thicker boards are not required even in damp rooms or in the wall heating version with copper pipe. As always, the manufacturer's specifications should be consulted when planning specific applications. Further information on the thermal activation of pitched roofs.
The amount of levelling compound required for low profile underfloor heating depends on the specific weight of the levelling compound. This is stated on the packaging and is usually between 1.6 and 1.8 kg/m² per 1 mm layer thickness. A specific weight of 1.6 and a layer thickness of 17 mm including underfloor heating results in a consumption of levelling compound of 25.9 kg per m². The recommended laying distance of 100 mm was assumed.
No RTL valve is required when connecting the radiant heating to a heating circuit manifold. As with the standard sets, the connection is made using the manifold fingers. The manifold finger is screwed onto the heating circuit manifold using the matching union nut. Ask our technical support for set prices without RTL box.
Technical Data Sheets
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Technical data - Low profile wet underfloor heating kitHeating capacity for different surface materials and other technical information119 KB
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Technical data sheet drywall underfloor heating kitHeating capacity and other technical information116 KB
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Technical data sheet ceiling heating kit drywallHeating capacity and other technical information110 KB
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Technical data - Ceiling heating kit with copper pipeHeating capacity and other technical information146 KB
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Technical data - Ceiling heating kit plasterHeating capacity and other technical information221 KB
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Technical data sheet dry construction wall heating kitHeating capacity and other technical information110 KB
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Technical data sheet plaster wall heating kitHeating capacity and other technical information218 KB
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Technical data - Wall heating plasterboard with copper pipeHeating capacity and other technical information144 KB
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